Odisha signs Intel, 3DGS semiconductor MoU

Intel, 3DGS sign Odisha chip substrate MoU: US chipmaker Intel and Arizona-based 3D Glass Solutions (3DGS) have signed an agreement with the Odisha state government to set up an advanced packaging glass-core substrate manufacturing facility in the state, as per a post on X. The proposed project could see investment of around USD 3.3 bn and create more than 1.8k direct high-skilled jobs.

The details: The facility will make glass-core and high-density interconnect substrates used in advanced semiconductor packaging. These substrates form the base on which chip components are mounted, making them a key input for AI, high-performance computing, telecom, and next-generation electronics.

Supply-chain step-up: The project would give India a foothold in a higher-value part of the semiconductor supply chain as New Delhi tries to build domestic chip capacity. Intel would act as the technology partner, bringing process expertise, technology licensing, quality systems, and workforce development.