{"id":90026,"date":"2026-06-01T00:00:00","date_gmt":"2026-06-01T00:00:00","guid":{"rendered":"https:\/\/enterpriseam.com\/mena-india\/?p=90026"},"modified":"2026-06-01T10:00:15","modified_gmt":"2026-06-01T10:00:15","slug":"odisha-signs-intel-3dgs-semiconductor-mou","status":"publish","type":"post","link":"https:\/\/enterpriseam.com\/mena-india\/2026\/06\/01\/odisha-signs-intel-3dgs-semiconductor-mou\/","title":{"rendered":"Odisha signs Intel, 3DGS semiconductor MoU"},"content":{"rendered":"<p style=\"padding:0;margin:0;line-height:1.15;orphans:2;widows:2;text-align:left\"><strong>Intel<\/strong><strong>, 3DGS sign Odisha chip substrate MoU:<\/strong> US chipmaker Intel and Arizona-based 3D Glass Solutions (3DGS) have signed an agreement with the Odisha state government to set up an advanced packaging glass-core substrate manufacturing facility in the state, as per a post <a target=\"_blank\" href=\"https:\/\/x.com\/MohanMOdisha\/status\/2060357935285649763\" style=\"\">on X<\/a>. The proposed project could see investment of around USD 3.3 bn and create more than 1.8k direct high-skilled jobs. <\/p>\n<p style=\"padding:0;margin:0;line-height:1.15;orphans:2;widows:2;text-align:left\"><strong>The details: <\/strong>The facility will make glass-core and high-density interconnect substrates used in advanced semiconductor packaging. These substrates form the base on which chip components are mounted, making them a key input for AI, high-performance computing, telecom, and next-generation electronics. <\/p>\n<p style=\"padding:0;margin:0;line-height:1.15;orphans:2;widows:2;text-align:left\"><strong>Supply-chain step-up: <\/strong>The project would give India a foothold in a higher-value part of the semiconductor supply chain as New Delhi tries to build domestic chip capacity. Intel would act as the technology partner, bringing process expertise, technology licensing, quality systems, and workforce development. <\/p>\n","protected":false},"excerpt":{"rendered":"<p>The proposed USD 3.3 bn facility would make glass-core and high-density interconnect substrates for advanced semiconductor packaging<\/p>\n","protected":false},"author":1,"featured_media":90027,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"newspack_ads_suppress_ads":false,"newspack_popups_has_disabled_popups":false,"newspack_sponsor_sponsorship_scope":"","newspack_sponsor_native_byline_display":"inherit","newspack_sponsor_native_category_display":"inherit","newspack_sponsor_underwriter_style":"inherit","newspack_sponsor_underwriter_placement":"inherit","ep_exclude_from_search":false,"_primary_brand":0,"newspack_featured_image_position":"","newspack_post_subtitle":"","newspack_article_summary_title":"Overview:","newspack_article_summary":"","newspack_hide_updated_date":false,"newspack_show_updated_date":false,"_jetpack_memberships_contains_paid_content":false,"footnotes":""},"categories":[2444],"tags":[2443,2402,2440,2734,2769],"brand":[],"newspack_spnsrs_tax":[],"class_list":["post-90026","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-also-on-our-radar","tag-also-on-our-radar","tag-enterpriseam-india","tag-manufacturing","tag-semiconductors","tag-technology","wpautop","entry"],"acf":{"mongo_id":"06f62efc-645c-4ca1-af15-26e872904e8b","order":"8","is_powered_by":false,"story_type":"1","photo_url":"https:\/\/ent.news\/2026\/6\/55.jpg","photo_position":"above","homepage_title":"","full_issue_title":"Odisha signs chip substrate MoU with Intel, 3DGS","related_issue":[90012],"teaser":"The proposed USD 3.3 bn facility would make glass-core and high-density interconnect substrates for advanced semiconductor packaging"},"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v27.1 (Yoast SEO v27.1.1) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>Odisha signs Intel, 3DGS semiconductor MoU - MENA India Corridor<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/enterpriseam.com\/mena-india\/2026\/06\/01\/odisha-signs-intel-3dgs-semiconductor-mou\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Odisha signs Intel, 3DGS semiconductor MoU\" \/>\n<meta property=\"og:description\" content=\"The proposed USD 3.3 bn facility would make 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